MPC Miniature Footprint: High-Density Optical Connectivity in a Compact Design

导言

As optical networks necessitate increased density and modular scalability, the Metallic PIC Connector (MPC) provides an ultra-compact footprint specifically designed for Co-Packaged Optics (CPO) and photonic integration. Featuring a low-profile height and optimized fiber pitch, the MPC enhances shoreline density, while ensuring scalability across various channel configurations.

 

Ultra-Compact Dimensions for High-Density Applications

The MPC Connector is engineered to achieve a minimal footprint while maximizing efficiency. Its design incorporates low profile heights to accommodate different channel configurations.

For the 8-channel configuration, the height is neatly minimized to 0.8mm. When scaling up, the 16-channel and 20-channel configurations maintain a low-profile height of 1.1mm, ensuring the MPC remains compact regardless of the increased capacity.

In addition to low profile heights, the 8-channel configuration has a width of 3.2mm, which is ideal for setups requiring a balance between density and space. The 16-channel configuration expands slightly to a width of 4.4mm, providing more channels without significantly increasing the footprint, while the 20-channel configuration has a width of 5.0mm.

Optimized Fiber Pitch for Precision Alignment

The MPC Connector ensures precise optical alignment with its meticulously designed fiber pitch, catering to different channel configurations. For the 8-channel setup, the connector employs a 250-micron fiber pitch. When it comes to the 16-channel and 20-channel configurations, the MPC Connector utilizes a 127-micron fiber pitch. This tighter spacing is instrumental in accommodating more channels within limited space, thereby maximizing optical performance while retaining a compact footprint.

 

Shoreline Density Options and Modular Scalability

Designed for scalable high-density optical interconnects, the MPC Connector is a versatile solution that supports a range of advanced features. One of the key advantages of the MPC Connector is its ability to achieve high shoreline density. Its compact footprint allows for maximum utilization of the switch faceplate, ensuring that more connections can be made within a limited space.

Moreover, the MPC Connector excels in modular scalability, a critical feature for adapting to various photonic and transceiver architectures. This modularity means that the connector can be easily integrated into different systems, providing flexibility and adaptability as network demands evolve.

Another significant aspect of the MPC Connector is its future-proof design. As optical networks continue to advance and new technologies emerge, the MPC Connector is designed to enable seamless integration into next-generation optical networks. This forward-thinking approach ensures that the connector remains relevant and effective, providing a reliable and efficient solution for years to come.

 

Why the MPC Connector Stands Out

The MPC Connector is renowned for its industry-leading miniature footprint, making it an ideal solution for space-constrained applications. By maintaining low-profile heights and widths across various channel configurations, the MPC Connector ensures that even the most densely packed systems can benefit from its superior interconnect capabilities.

Its precise fiber pitch is crucial for ensuring low-loss optical coupling with different fiber sizes. By achieving such precise alignment, optical signals are transmitted with minimal interference and maximum efficiency. The MPC Connector is adaptable to multiple channel configurations for evolving Co-Packaged Optics (CPO), Photonic Integrated Circuits (PIC) applications, and next generation photonic interconnects.