技术博客

SENKO’s Grade-Q Connectors

Quantum computers are anticipated to solve mathematical problems that conventional computers which u...

Surface and Edge Coupling: Versatility of the MPC Connector

Photonics integration necessitates precise light coupling methods to optimize efficiency in Photonic...

MPC Main Applications: Enabling Next-Generation Optical Connectivity

The Metallic PIC Connector (MPC) is an essential component in next-generation optical and photonic i...

MPC Miniature Footprint: High-Density Optical Connectivity in a Compact Design

s optical networks necessitate increased density and modular scalability, the Metallic PIC Connector...

金属PIC连接器

The Metallic PIC Connector (MPC) is an advanced optical interconnect designed for Photonic Integrate...

High-Precision Metal Stamping Technology in SENKO’s MPC Connector

In the realm of advanced optical connectivity, SENKO’s MPC (Metallic Precision Connector) stands o...

共封装光学CPO的能效

As data rates continue to surge past 800G and into multi-terabit speeds, energy efficiency is becomi...

Timeline of Advancements in the Transition to Co-Packaged Optics

The journey toward Co-Packaged Optics (CPO) began with the widespread adoption of pluggable optical ...

The Rise of Co-Packaged Optics (CPO): Revolutionizing High-Speed Connectivity

The explosive growth of Artificial Intelligence (AI), High-Performance Computing (HPC), Machine Lear...

SENKO’s Total Integrated Solution for Next-Generation Transceivers

As network demands continue to grow, the development of next-generation transceivers capable of supp...

The Evolution of Optical Transceivers and SENKO’s Role in Maximizing Their Potential

Optical transceivers have undergone significant advancements over the years, evolving to meet the ev...

SENKO’s Technical Solutions to Support Advancements in On-Board Optics

The rapid evolution of data-intensive applications, such as artificial intelligence, cloud computing...