SENKO’s Total Integrated Solution for Next-Generation Transceivers

As network demands continue to grow, the development of next-generation transceivers capable of supporting 1.6Tbps and beyond has become essential. These transceivers require high fiber density, low-loss connectivity, and efficient data transmission to meet the evolving needs of high-speed network infrastructure. SENKO Advanced Components provides a totally integrated solution, delivering high-performance connectivity solutions that enhance fiber density, improve efficiency, and enable seamless integration within transceivers.

 

Meeting the Demands of 1.6Tbps and Beyond

To support the massive data transmission rates required for 1.6Tbps and beyond, transceivers must be designed with high fiber density and optimal signal integrity. The industry is shifting towards compact and high-density connectivity solutions to maximize port efficiency while ensuring low insertion loss and high performance. SENKO’s innovative connectivity solutions address these challenges by offering advanced connector assemblies that streamline integration within transceivers.

 

MPO Connector Assembly for High-Density Connectivity

SENKO’s MPO (Multi-Fiber Push On) connector assembly serves as the essential interface to transceivers, providing a robust and high-density connectivity solution. The MPO EZ-Way connector features a lower profile design, allowing for double the number of MPO connectors on the transceiver interface compared to traditional MPO connectors. This increased connector density enhances fiber management, enabling higher bandwidth support within compact transceiver designs.

Additionally, the MT-MPO adapter acts as a crucial bridging component, seamlessly connecting the MT ferrule to the MPO connector. The MT-MPO adapter has a locking feature which secures the MT ferrule in the adapter. This removes the need for a Behind-the-Wall (BTW) MPO connector, which reduces the space requirement.

SN-MT Connector for Ultra-High Fiber Density

The SN-MT connector further revolutionizes fiber density, enabling up to 4x SN-MT connectors to fit within a QSFP-DD or OSFP transceiver. This compact design significantly enhances transceiver scalability, allowing for increased data throughput within the same footprint.

To optimize internal transceiver connectivity, the SN-MT Mini connector serves as an ideal interface within the transceiver, maintaining compactness without compromising performance. Additionally, SENKO’s Micro Ferrule Connector (MFC) provides a direct interface between the SN-MT connector and the fiber assembly leading to the optical chip. This facilitates a streamlined fiber path while ensuring precise fiber alignment and minimal signal loss.

Metallic PIC Connector (MPC) for Direct Chip Coupling

As transceiver technology advances, the need for efficient light coupling to the optical chip becomes critical. SENKO’s Metallic PIC Connector (MPC) directly couples light into the chip, enabling high-performance data transmission with minimal insertion loss. The MPC ensures precise alignment and optimal light transmission, making it a key component in next-generation transceiver architecture.

MPC is constructed from stamped metallic optical benches. They include micro mirror arrays for folding and focusing light beams between optical fibers and photonic devices. Mirror designs are available for multimode and single-mode applications. It significantly lowers connector heights to 0.6mm compared to vertical coupling fiber arrays.

Conclusion

SENKO’s total integrated solution provides cutting-edge connectivity innovations that drive the development of next-generation transceivers. By leveraging high-density connectors like the MPO EZ-Way, SN-MT, and MPC, SENKO enables transceivers to achieve higher bandwidth, improved fiber management, and efficient signal transmission. As network speeds continue to advance, SENKO remains at the forefront of delivering high-performance connectivity solutions tailored to the evolving needs of the industry.