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The MPC leverages highly reflective metallic optical mirrors which shape and steer light precisely to and from the PIC (Photonic Integrated Circuit). The MPC is a universal solution providing EDGE and SURFACE coupling in both PERMANENT and DETACHABLE variants. Manufactured with a proprietary stamping process, the MPC paves the way for cost-efficient high-volume manufacturing.

MPC Overview

MPC - Tiny footprint

Big benefits, tiny footprint

The MPC leverages highly reflective metallic optical mirrors which shape and steer light precisely to and from the PIC (Photonic Integrated Circuit). The MPC is a universal solution providing EDGE and SURFACE coupling in both PERMANENT and DETACHABLE variants. Manufactured with a proprietary stamping process, the MPC paves the way for cost-efficient high-volume manufacturing.

Making PIC Coupling Practical

MPC Series - Featured Content Detachability

Detachability

Enables cost-effective CPO switch deployments with a modular building block approach.

MPC Series - Featured Content Wafer

Wafer Level Testing

Identifies potential failures early in the manufacturing process

MPC Series - Featured Content HVM

High Volume Manufacturing

The MPC Precision stamping process is highly scalable, repeatable and transferable

MPC video animation

The MPC is the smallest metallic PIC connector in the world. Its low profile, detachable design facilitates optimised space utilisation within congested CPO switch environments.

MPC Applications

MPC Application - CPO

CPO Switches

The MPC connector enables detachable surface and edge coupling, optimized for the shoreline of CPO switch ASICs

MPC Application - Transceiver

Pluggable Transceivers

The MPC provides dependable detachable coupling to support seamless integration and optimal performance in next-generation transceivers

MPC Application - PCIE

PCIE Cards

The MPC connector enables high-speed, low-latency data transmission in compact and high-density environments such as PCiE cards.

MPC Application - Emerging Technologies

Emerging Technologies

GPU to GPU applications

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SENKO’s ELSFP optical connection is a cutting-edge solution designed for seamless integration in Co-Packaged Optics (CPO) application

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MPC Resources

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