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Managing Fiber Routing Within High Data Rate Switches with Limited Space
The increasing demand for high data rates and bandwidth in modern data centers poses significant challenges for fiber routing, particularly in environments where space is limited. High-density fiber connectors like MT, MPO, SN, and SN-MT enable efficient fiber management and high-performance data transmission in these compact spaces. SENKO Advanced Components has been at the forefront of developing innovative solutions to meet these challenges, including advanced products like the Metallic PIC Connector, MBMC MT Connector, and SN Optical Backplane Connector. These cutting-edge connectors are specifically designed to handle high fiber densities, support mid-board and transceiver connections, and interface with photonic integrated circuits (PICs). These solutions were incorporated in developing a revolutionary 51.2TB switch in collaboration with Wistron®.
The Critical Role of High Data Rate Switches
As data rates soar to 400G, 800G, and beyond, high-density switches require advanced fiber routing solutions to manage the increasing number of connections. The space limitations in these high-performance systems demand compact, reliable, and high-density fiber connectors. SENKO’s portfolio of products, including the Metallic PIC Connector, MBMC MT Connector, and Optical SN Backplane Connector, helps solve these challenges by providing efficient connectivity that maximizes space and performance in data centers.
A major topology in hyperscale Data Center Interconnects (DCI) is the leaf-spine architecture, essential for cross-connecting leaf and spine switches. This network configuration typically utilizes MPO and LC breakout cables, or fiber shuffle boxes between switches. By employing SN connectors, the overall cost and complexity of this configuration can be decreased, as SN-based transceivers are already separated into four distinct SN connectors at the transceiver interface. Furthermore, various fiber types such as PM fibers, ribbon fibers, and protective sleeving can be managed independently.
SENKO’s High-Density Fiber Connectors
SENKO’s suite of high-density connectors is specifically engineered to address the needs of today’s data centers. These connectors provide the reliability, scalability, and performance required for applications like transceiver connections, mid-board connections, and PICs. SENKO’s solutions are widely used in modern data centers, enabling the seamless scaling of fiber infrastructures in compact spaces.
Let’s dive into SENKO’s advanced connectors and their specific applications.
SENKO’s Advanced Connector Solutions
MT (Mechanical Transfer) Ferrule
MT ferrule forms the foundation for many high-density fiber solutions. Capable of supporting 12, 24, or more fibers in a single ferrule. MT ferrules are frequently deployed in mid-board optical modules and photonic integrated circuits (PICs), where high fiber counts are needed. They enable high-speed data transmission between PICs and transceiver modules, helping data centers manage the space limitations of these high-bandwidth systems.
MPO (Multi-Fiber Push-On) Connectors
MPO connectors, based on MT ferrules, provide high-density, multi-fiber connections that are ideal for parallel transmission applications, such as 100G and 400G Ethernet systems. SENKO is a world leader in low-loss MPO connectors that are extensively used in QSFP and OSFP transceivers, enabling high-density, multi-fiber connections, making them ideal for transceiver-to-switch interfaces where space and performance are both critical.
SENKO’s SN Connector
The SN connector, designed by SENKO, is a high-density duplex fiber connector optimized for data centers. It offers double the fiber density of traditional LC connectors while maintaining excellent performance, making it a perfect choice for high-bandwidth, space-constrained environments. SN connectors are increasingly used in 400G and 800G Ethernet transceivers and mid-board connections. Their compact size and high-density capability make them ideal for high-speed applications where space optimization is critical.
SENKO’s SN-MT Connector
The SN-MT connector combines the benefits of the SN duplex format with the multi-fiber MT ferrule, providing ultra-high-density connectivity that is particularly well-suited for applications requiring dense fiber counts, such as photonic integrated circuits (PICs). SN-MT connectors are essential for photonic integrated circuits (PICs) as fiber density required for advanced optical applications increases on the faceplate or on the mid-board. They are often used in co-packaged optics and other applications requiring compact, high-performance connectivity.
SENKO’s Metallic PIC Connector (MPC)
SENKO’s Metallic PIC Connector is designed to meet the high-performance requirements of photonic integrated circuits (PICs). This connector enables ultra-precise alignment and robust connection between the fiber array and PICs, making it a crucial component for managing the growing complexity of integrated photonic systems. The MPC is used in PIC-based systems for high-speed optical communication, where accurate fiber alignment and connection reliability are paramount. The metallic body offers enhanced durability and temperature tolerance, making it ideal for data centers and telecommunications systems that rely on high-speed PICs to handle massive data flows with minimal signal loss.
In addition, a detachability feature is also introduced to the PIC connector. This feature allows fiber-optic cables to be disconnected and re-connected to the PIC during the packaging process. It is no longer necessary for fiber-optic cables and connectors to withstand the solder reflow process and it also allows cables to be replaced during service. Being detachable, the MPC can also be deployed as a mid-board connector to take advantage of the enhanced durability and temperature tolerance features.
SENKO’s MBMC MT Connector
The MBMC (Mid-board Miniature Connector) MT Connector is another advanced solution from SENKO. It is designed for mid-board connections where space is limited, but high performance is required, offering a miniature, compact form factor while leveraging the high-density capabilities of the MT ferrule. This connector is perfect for applications requiring direct optical connections from board-level components, such as transceivers and PICs, to backplanes or other high-performance systems. These connectors provide direct fiber connections to mid-board transceivers, reducing the space and power consumption associated with external fiber management systems.
SENKO’s Optical SN Backplane Connector
SENKO’s Optical SN Backplane Connector is designed to meet the demands of high-density backplane connections in data centers and telecommunications systems. This connector enables multiple optical fibers to efficiently connect backplane-mounted PICs or transceivers with fiber arrays in the compact space of a backplane while maintaining excellent signal integrity.
Conclusion
High-density optical fiber connectors like MT, MPO, SN, SN-MT, and SENKO’s advanced solutions—such as the Metallic PIC Connector, MBMC MT Connector, and Optical SN Backplane Connector—are transforming the way fiber routing is managed in modern data centers. These innovative connectors allow data centers to scale efficiently by maintaining the footprint of the switches to 1RU where possible. Using high-density connectors allows us to optimize space, facilitating the routing of fibers between the faceplate, mid-board, and chip.
As data rates continue to climb to 400G, 800G, and beyond, SENKO’s connectivity solutions will play a key role in enabling the next generation of high-speed, high-performance data center infrastructure.
Data Center
