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QPICPAC Module
QPICPACマルチファイバーフォトニック集積回路（PIC）モジュールは、標準PICまたは量子PIC（QPIC）の両方に対応するハーメチックソリューションです。これらの(Q)PICパッケージは、以下の方法で組み立てられます。 アルター・テクノロジー UK’s advanced manufacturing techniques to reduce size and maximize stability and reliability. The module can be specified with SENKO low-loss single mode cable assemblies that are terminated with SENKO’s Metallic PIC Connector (MPC).
Design Kits (PDKs) are available from ウェーブ・フォトニクス QPICとMPCの互換性を計画するため。
特徴
- 高い信頼性を実現するハーメチックシール
- Integrated TEC and temperature sensor for precision
control in harsh environments - 超低損失性能
- 配備を簡素化するテンプレートが利用可能
- ほとんどの(Q)PIC設計に対応
- SENKOのMPCテクノロジー「CudoFormTM」を採用
- Automotive LIDAR
- Telecoms
- Space
- Quantum technology
- PIC test and validation
The QPIC PAC is a packaging module designed for Quantum Photonic Integrated Circuits (QPICs), featuring fiber assembly to enhance performance and streamline packaging processes.
The waveguide grating is developed for wideband vertical coupling to Photonic Integrated Circuits, aiming to improve performance over a broad bandwidth.
The MPC assemblies have shown an approximate 2 dB performance improvement over a 90-degree fiber array across a bandwidth of 30 nm (1530 nm to 1580 nm).
The new package builds simplify and reduce the cost of packaging for QPIC technologies, making it more accessible to chip designers and component manufacturers.
The MPC assembly improves performance by enhancing the coupling efficiency and reducing losses over a wide bandwidth.
The MPC assembly covers a bandwidth of 30 nm, specifically from 1530 nm to 1580 nm.
The 2 dB improvement indicates a substantial enhancement in signal quality and efficiency, which is crucial for high-performance photonic applications.
The PDK (Process Design Kit) helps chip designers by providing essential tools and guidelines to simplify and reduce the cost of QPIC packaging.
This bandwidth range is critical for many photonic applications, offering optimal performance for telecommunications and quantum computing technologies.
SENKO ensures quality through rigorous testing, continuous improvement, and adherence to industry standards.
Yes, the QPIC PAC can be tailored to meet specific requirements and applications, offering flexibility and adaptability for various industries.
Efficient light input/output is essential for reducing power requirements and maintaining quantum entanglement in PICs, which is critical for their performance.
Traditional methods like fiber arrays and photonic wire bonding are often lossy, leading to inefficiencies in light coupling.
SENKO offered standard fiber arrays and CudoForm MPC assemblies for testing to improve coupling efficiency.
Improved performance through SENKO’s innovations could set new standards for fiber-to-PIC coupling, enhancing the overall efficiency and reliability of PICs.
Integrating CudoForm into the Lucida PDK assembly packaging, such as QPIC PAC wideband, can lead to more widespread adoption by quantum photonics developers due to enhanced performance and reduced costs.
Future mass production of chips could benefit from these advancements through reduced costs, improved performance, and streamlined packaging processes.
