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Overview of the MPC Connector and Its Applications

The Metallic PIC Connector (MPC) is an advanced optical interconnect designed for Photonic Integrated Circuits (PICs) and Co-Packaged Optics (CPO). It serves as a crucial interface between fiber optic communication systems and photonic chips, ensuring efficient light coupling and signal integrity in high-performance computing, data centers, and telecommunications infrastructure.

The MPC enables seamless integration of optical fibers with PICs, allowing for high-speed, low-loss and low latency optical signal transmission. It is particularly beneficial in next-generation optical networks, where compact, scalable, and high-density photonic packaging is essential to bring fiber directly to ASICS with reduced power consumption. The metallic construction of the MPC ensures durability, making it a long-term solution for photonics packaging.

 

Key Components of the MPC Connector Assembly

The MPC connector assembly comprises several critical components that contribute to its robust performance:

Thermally Stable KOVAR / INVAR CTE Matched Frame – The metallic housing utilizes KOVAR/INVAR materials, matching the Coefficient of Thermal Expansion (CTE) to the PIC substrate. This ensures dimensional and structural stability under varying thermal conditions to maintain alignment between the fiber and chip.

Mechanical Optical Bench (MOB) Stamped Aluminium Groove Array – The MOB has precision-stamped grooves used to accurately position the fiber in the MPC. It provides a rigid and reliable mounting surface to maintain precise alignment between the fiber and the micro-mirror array.

Fiber Alignment and Epoxy Dispense – The fiber interface ensures efficient coupling of optical fibers to the connector while the epoxy dispense process ensures fibers are fixed in place while ensuring durability. The epoxy used has a matching CTE with optical fiber to ensure constant fiber adherence to the MOB throughout its operation.

Glass Cover for Protection and Stability – The glass cover encapsulates the assembly to prevent environmental contamination and protect delicate optical components while maintaining optical clarity.

Advantages of the MPC Design with Freeform Micro-Mirror Array

A standout feature of the MPC connector is its freeform micro-mirror array, which enhances light manipulation by precisely shaping and steering light. The micro-mirror array provides precise light guidance to ensure optimal alignment between fiber output and PIC input. The aspherical mirror is designed to adjust the beam focus or expansion to match the chip I/O size, improving coupling efficiency. The microfabrication technique used to manufacture the MPC connector creates sub-micron structures minimizes aberrations. The versatility of the MOB with micro-mirror array design makes it optimized for various applications such as silicon photonics, photodiode arrays, and expanded beam.

The light beam is shaped to the application requirement for improved coupling efficiency before reaching the intended interface at the desired angle and focal point, ensuring optimal energy transfer. The optimized optical pathways are crucial for higher data rates and improved power efficiency.

結論

The Metallic PIC Connector (MPC) assembly plays a pivotal role in advancing Co-Packaged Optics (CPO) and Photonic Integrated Circuits (PICs). Its innovative micro-mirror array and precision light steering capabilities make it a game-changer in the optical communication industry, driving the future of high-speed, low-loss data transmission.