High-Volume Manufacturing with SENKO’s Metallic PIC Connector (MPC)

In the ever-evolving world of optical and photonic applications, precision, scalability, and cost-effectiveness are key factors driving the adoption of high-volume manufacturing (HVM) techniques. SENKO’s メタリックPICコネクタ（MPC） leverages an innovative approach that combines Stamping and MEMS Microfabrication, striking the perfect balance between mass production efficiency and sub-micron accuracy.

 

Manufacturing Techniques for Optical and Photonic Applications

Various advanced manufacturing techniques contribute to the production of high-precision optical and photonic components:

• Stamping – A cost-effective and repeatable process for mass production of metal parts, offering high-speed manufacturing with minimal material waste. Stamping involves placing flat sheet metal, in either coil or blank form, into a stamping press. In the press, a tool and die surface form the metal into the desired shape.
• MEMS (Micro-Electro-Mechanical Systems) Microfabrication – Utilized for creating sub-micron structures with high precision, commonly used in photonics and semiconductor industries. It is a series of techniques that can modify a substrate material in an additive or subtractive manner to convert a thin, generally planar, substrate into a complex structure of multiple materials through the interaction of microscopic features.
• Casting & Die Casting – Suitable for large-scale production of complex metal components, though often limited in achieving ultra-high precision. It is a metal casting process that involves feeding molten nonferrous alloys into dies under high pressure and at high speed to rapidly create molded products.
• Milling & Turning – CNC-controlled machining processes capable of producing intricate parts with high accuracy but generally slower for mass production. In turning, the workpiece rotates and the cutting tool typically does not. In milling, the cutting tool moves and rotates while the workpiece remains fixed.
• Electrical Discharge Machining (EDM) – Ideal for cutting ultra-hard materials with precision but not always scalable for high-volume production. EDM is a metal fabrication process that forms shapes using electrical discharges (sparks). Material is removed from the workpiece by rapid current discharges between two electrodes, separated by a dielectric liquid and an electric voltage.
• Grinding – Provides high-precision surface finishing, typically used in conjunction with other machining methods. It is a machining process involving the removal of material from a workpiece by means of a rotating abrasive wheel.
• Diamond Turning – Used to achieve optical-grade surface finishes, particularly in lens manufacturing. Diamond turning is turning using a cutting tool with a diamond tip.
• Lithography – A semiconductor industry staple, allowing for intricate patterning with nanometer precision. It is a photographic process by which a light-sensitive polymer, called a photoresist, is exposed and developed to form 3D relief images on the substrate.

SENKO’s Sweet Spot: Stamping + MEMS Microfabrication

SENKO’s MPC manufacturing solution strategically integrates Stamping and MEMS Microfabrication to achieve the best of both worlds for high-volume, high precision manufacturing. This synergy allows for scalable, cost-effective, and precise optical component manufacturing, making it ideal for applications in Co-Packaged Optics, PIC Connectivity, and high-density fiber interconnects.

By leveraging this unique Stamping + MEMS combination, SENKO’s MPC offers several advantages for the optical and photonic industry. High-speed mass production capability ensures cost-efficient scalability. The stamping method reduces material and labor costs compared to traditional machining methods, while the MEMS microfabrication provides sub-micron accuracy for critical optical and photonic applications.

Consistent production quality ensures long-term performance in demanding environments of high-bandwidth photonics applications. The MPC can seamlessly be integrated with existing photonic integrated circuits (PICs) and optical transceivers. As demand for high-speed optical communication and advanced photonic devices grows, SENKO’s Metallic PIC Connector (MPC) stands at the forefront of high-volume manufacturing, setting a new industry standard in precision and efficiency.

 

結論

At SENKO, we leverage the perfect balance between precision and manufacturability, ensuring that our MPC Connector and optical solutions meet the stringent demands of next-generation photonics and Co-Packaged Optics. Our high-volume production capabilities make us a trusted partner for large-scale optical connectivity solutions.

The integration of Stamping and MEMS technology represents the future of High-Volume Manufacturing for optical interconnects. This approach strikes the ideal balance between cost, precision, and scalability, ensuring that next-generation photonic and optical solutions remain both accessible and cutting-edge.