SENKO’s Technical Solutions to Support Advancements in On-Board Optics

Introducción

The rapid evolution of data-intensive applications, such as artificial intelligence, cloud computing, and high-speed networking, has necessitated advancements in on-board optics. Traditional electrical interconnects face limitations in bandwidth, power consumption, and density, making optical solutions a compelling alternative. To address these challenges, several innovative technologies have been introduced by SENKO, including high-density fiber connectors, external laser sources, mid-board and backplane connectors, specialty fibers, and metallic photonic integrated circuit (PIC) connectors. These solutions enhance optical interconnect performance, improve integration, and enable future scalability.

 

High-Density Fiber Connectors

One of the primary challenges in advancing on-board optics is increasing faceplate density to accommodate more optical channels. Traditional fiber connectors are limited in their ability to scale, prompting the development of high-density solutions like:

• MPO (Multi-Fiber Push On) Connectors: MPO connectors enable multiple fiber connections in a compact footprint, supporting parallel optical links and high-bandwidth applications. Additional development introduced the MPO PLUS EZ-Way which further increases fiber density.
• SN-MT Connectors: The SN-MT connector, designed for high-density applications, further increases faceplate density by offering multiple fiber terminations in a small form factor, enabling more efficient fiber management in high-speed optical modules. The SN-MT connector utilizes a smaller version of the MT ferrule which is designed for the smaller 200-micron fiber. This enables the SN-MT connector to achieve 2.7 times the density of MPO connectors whilst leveraging the same proven alignment methods.

External Laser Source (ELSFP)

Power efficiency and thermal management remain key challenges for on-board optics. An emerging solution to these issues is the External Laser Source (ELSFP), which separates the laser from the transceiver module, offering several benefits. Moving the laser source external to the equipment reduces thermal load within the module, improving reliability and efficiency.

This also enables the use of high-power, high-quality laser sources that can support multiple optical links. System scalability is enhanced by decoupling laser lifespan from the transceiver, allowing independent upgrades of optical components. ELSFP is a promising technology that optimizes power consumption and improves the overall performance of optical networks.

SENKO has developed the ELSFP, allowing the laser module to be quickly and easily ‘blind-mated’ to the host connectors that are mounted within the CPO equipment.

Mid-Board and Backplane Connectors

For efficient optical interconnects within a system, mid-board and backplane connectors play a critical role. These connectors facilitate optical signal routing between different circuit board layers and modules, ensuring minimal signal loss and improved system performance.

Mid-board connectors are placed near the optical engines to provide direct fiber connectivity, reducing insertion loss and enabling high-speed optical signal transmission. Backplane connectors are designed to connect optical backplanes with minimal crosstalk, ensuring reliable signal integrity in complex, high-bandwidth environments. These connectors are essential for high-performance computing, data centers, and telecommunications applications.

SENKO has a range of low profile and high-density connectivity solutions that are based on multi-fiber MT ferrules. As bandwidth demand further increases, requiring fiber-to-the-chip solution, fiber array assemblies, and MPC connectors can be deployed.

Metallic PIC Connector for Fiber-to-Chip Coupling

Efficient coupling between optical fibers and photonic integrated circuits (PICs) is crucial for on-board optics. The Metallic PIC Connector (MPC) is a novel solution that enhances fiber-to-chip coupling by providing precise alignment and robust mechanical stability. It enables high-density optical interconnects for compact optical systems which is crucial for ensuring high-performance optical signal transmission in next-generation photonic systems.

Conclusión

As data demands continue to grow, advancements in on-board optics will be crucial to meeting the challenges of high-speed, high-density, and low-power optical interconnects. The introduction of high-density fiber connectors, external laser sources, mid-board and backplane connectors, and MPC connectors represent a significant leap in optical networking technology. By leveraging these innovations, data centers, telecommunications networks, and high-performance computing environments can achieve greater efficiency, scalability, and performance in the era of optical connectivity.