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ECOC 2024
Highlights
booth B6
Alliance Partners
LC EZ-Flip - Fastest Polarity-Switchable LC
Experience lightning-fast polarity switching with the LC EZ-Flip connector. In under 1 second, users can effortlessly switch polarity without the hassle of rotating ferrules or exposing fibers. Designed for ultimate convenience, pull-tabs can be retro-fitted to the connector, offering improved access in high-density applications. Alternatively, opt for a push-pull boot from our LC EZ-Way range for seamless integration.
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Connecting AI Clusters with SN-MT
The SN-MT16 is the preferred low-loss, multi-fiber connector for seamlessly linking data centers within a Unified Mesh. Boasting a footprint 2.7 times smaller than the MPO connector and offering fiber counts ranging from 16 to 32, the SN-MT reduces trunk size, simplifies deployment and optimizes patch panel density at both ends of the link
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Connecting to 800G the EZ-Way
With the global surge in AI-driven applications, there is a soaring demand for 800G pluggables. SENKO’s EZ-Way range of MPO and LC connectors has been meticulously optimized to meet the requirements of these ‘belly-to-belly’ transceiver configurations. Additionally, they feature a convenient push-pull boot, ensuring swift and hassle-free access in high-density environments.
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IP-9 MPO Solution
The IP-9 MPO is an extremely compact IP68-rated outdoor connector that supports up to 24 fibers in a single housing. This high-density solution makes it the ideal choice for FTTH and FTTA Feeder applications.​
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Building Leaner Networks SN-Uniboot
The Base-8/Base-2 flexibility of the SN-Uniboot allows optical links to be deployed without cassettes or unnecessary mated connector pairs. This reduces the material useage, enhances the performance and lowers the total cost of ownership in all areas of the network. This leaner approach drives sustainability amd lowers the carbon footprint.
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CS – The EZ-Way to build Core Networks
The CS connector harnesses the high performance and carrier-grade reliability of LC ceramic 1.25mm ferrules, repackaging them into a compact and accessible footprint. This innovative design doubles the density of patch panels and equipment, allowing for seamless transition from LC to CS connectors to optimize network real estate while maintaining maximum performance.
